G09900 - SEMI G99 - Specification for Flowability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G99-1122 - Current SEMI C28 — Specification for

SEMI C28 — Specification for Hydrofluoric Acid

多結晶シリコンPolycrystalline silicon（SEMI M16 あるいは JEITA EM-3601A参照）

optical profilometers

This Test Method can be used for silicon in a range of physical forms

global Flat Panel Display ― Materials & Components Committeeで技術的に承認されている。現版は2012年12月20日，global Audits and Reviews Subcommitteeにて発行が承認された。2013年2月にwww

G09900 - SEMI G99 - Specification for Flowability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G99-1122 - Current SEMI C28 — Specification forMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular, and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of