Diamond Wire of 0.125 mm Dia. x 65 m L (215 feet) for Wire Saw Cutting EQ-DW0125x65 Pouch Cell 8 Gold Plated spring load

8 Gold Plated spring load holders with adjustable height for measuring cylinder or coin cell up to 70mm(H) (please click a picture below 1-2 to enlarge)

2 Application Notes --

and one of the advantage from water-based (Aqueous) chemistry is it isn't prone to catching fire

Material Cubic Boron Nitride

Spinning Time: 1 - 60s

Diamond Wire of 0.125 mm Dia. x 65 m L (215 feet) for Wire Saw Cutting EQ-DW0125x65 Pouch Cell 8 Gold Plated spring loadDiamond wire cutting is a state of the art technology to slice a single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub surface damage, and contamination free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price. Specifications: Part Number EQ DW0125x65 Tensile Strength 30 N Features Electroplated diamond wire with 0. 125 mm (+