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Semiconductor devices - Time-dependent dielectric breakdown (TDDB) test for inter-metal layers Ingestion-build-242630 and practical air start equipment

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and practical air start equipment

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Semiconductor devices - Time-dependent dielectric breakdown (TDDB) test for inter-metal layers Ingestion-build-242630 and practical air start equipment1 Scope This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time dependent dielectric breakdown (TDDB) test for inter metal layers applied in semiconductor devices.

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