US$ 164.80
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Ge Wafer ,N-type Undoped (100) 3" dia x 0.5 mm 2 side polished resistivity: >50 ohm-cm Storage Chambers/Fume Hoods 5 Hygroscopic slightly yes none
$224.22
Description
5 Hygroscopic slightly yes none No no no no Afterglow % at 6ms < 2 - 40 ns - 0
Processing Chart: How to Make Cylinder Cell
The full diamond sintered blade is suitable for low speed cutting ( under 1000 RPM) of crystalline oxides or any brittle crystals
ID: 52 mm
Surface roughness: Ra < 10 A ( by AFM)
Ge Wafer ,N-type Undoped (100) 3" dia x 0.5 mm 2 side polished resistivity: >50 ohm-cm Storage Chambers/Fume Hoods 5 Hygroscopic slightly yes noneGe Wafer Specification Growing Method: CZ Orientation: (100) + _0. 5 Deg. Wafer Size: 3" dia x 0. 5 mm Surface Polishing: two sides optical polished Surface finish (RMS or Ra) : < 30A Doping: Undoped Conductor type: N type Resistivity: >50 Ohms cm (If you would like to measure the resistivity accurately, please order our Portable 4 Probe Resistivity Testing Instrument.) Package: under 1000 class clean room in wafer container Related Product Other
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