Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect Ingestion-build-52208 a) electrical test and measurement

a) electrical test and measurement equipment which by electrical means tests

BS 4999-143 will be revised to cover only the “basic” tests

BS EN 1998-6 establishes requirements

3 DEFINITIONS

This is the second edition of BS EN ISO 17672:2016 and replaces the 2010 standard

Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect Ingestion-build-52208 a) electrical test and measurementWhat is this standard about? This part of IEC 63011 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die to die alignment is used in the die stacking.