Semiconductor devices. Mechanical and climatic test methods - Solderability algolia-ignore Annex C (informative) includes significant

Annex C (informative) includes significant technical differences between this document and EN 14434:2004

Suitability of extinguishers for use on class D fires (fires involving flammable metals) is outside the scope of this standard in respect of test fires

WC flushing cistern manufacturers and designers

ISO 13851 discusses safety regarding two-hand control devices (THCD)

Designer of cableway installations

Semiconductor devices. Mechanical and climatic test methods - Solderability algolia-ignore Annex C (informative) includes significant1 Scope This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin lead (SnPb) or lead free (Pb free) solder for the attachment. This test method provides a procedure for dip and look solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability