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Cu Single Crystal Substrate: (111)with edge <110> 5x5x1.0 mm, 1side polished CIP Density: 6 g/cm^3
Cu Single Crystal Substrate: (111)with edge <110> 5x5x1.0 mm, 1side polished CIP Density: 6 g/cm^3
$125.35
Description
Density: 6 g/cm^3
Withdraw only
Surface roughness: Ra<10A
Diameter of Sealing Plug: 7 ± 0
Please bake the powder in a vacuum oven at 120 - 150 °C before making slurry and coating to ensure max
Cu Single Crystal Substrate: (111)with edge <110> 5x5x1.0 mm, 1side polished CIP Density: 6 g/cm^3Single crystal copper metallic substrate Purity: >99. 99% (Oxygen < 80 ppm) Size: 5x5x1. 0 mm Orientation: <111> + 2o Edge orientation :<110> Surface finish (RMS or Ra) : One side polished < 30A Packing: in 1000 class cleanroom with vacuumed bag Application: substrates for metal, alloy film and biological materials
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
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- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
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