15T Hydraulic Press with 0.5" Heatable Die (250C Max) for Cold Sintering Process (CSP) - YLJ-CSP-15 SOI (Silicon On Insulator) Wafer size: 3" dia x

Wafer size:   3" dia x  0

Warning: The time for Screen and Sleep should be set to "NEVER" in the Power& Sleep setting of your computer to avoid causing disconnection from the battery analyzer

please click the picture below for a detailed size

Size:           5mm x 5mm x 0

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15T Hydraulic Press with 0.5" Heatable Die (250C Max) for Cold Sintering Process (CSP) - YLJ-CSP-15 SOI (Silicon On Insulator) Wafer size: 3" dia xYLJ CSP 15 is a 15 T max. manual hydraulic press with heatable uniaxial die (0. 5" ID) up to 250 C max. It is designed for the cold sintering process (CSP) of ceramic, polymer, or ceramic polymer composite materials for applications such as microwave dielectric materials, solid state electrolyte, and semiconductor. The compact design of the press makes it well suited for inside glove box operation with an inert gas environment. Reference: Application