50 Ohms cm EPD: N A Package: under 1000 class clean room in wafer container Related Product Other Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> 50 Ohms cm EPD: N A Package: under 1000 class clean room in wafer container Related Product Other Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> 50 Ohms cm EPD: N A Package: under 1000 class clean room in wafer container Related Product Other Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> Ge Substrate (111) 10x10x 0.5 mm, 1 SP, N-type Undoped .R>50 ohm.cm Flanges Size: 2" Dia x0 – fit7alimentos.com.br

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Ge Substrate (111) 10x10x 0.5 mm, 1 SP, N-type Undoped .R>50 ohm.cm Flanges Size: 2" Dia x0

$45.94

Quantity
Description

Size:     2" Dia x0

Procedure for Testing Flow Cell - click the picture to enlarge

Wafer size: 2" diameter x 0

then connect it to vacuum pump or gas recovery system

especially for cutting plastics

Ge Substrate (111) 10x10x 0.5 mm, 1 SP, N-type Undoped .R>50 ohm.cm Flanges Size: 2" Dia x0Specifications Growing Method: CZ Wafer Size: 10x10x0. 5 mm Surface Polishing: one side epi polished Orientation: (111) Surface roughness: < 8 A ( by AFM) Doping: Undoped Conductor type: N type Resistivity: >50 Ohms cm EPD: N A Package: under 1000 class clean room in wafer container Related Product Other Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater

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