Semiconductor Metrology Instruments StdPbc-0921 Measurement Data Summary Technique and

Measurement Data Summary Technique and Data Usage for Test Report

1  The scope of this Standard is for grades of mixed acid etchants used in the semiconductor industry

previously published January 2017

and Flatness of Bonded Wafer Stacks

プロセス・プラズマが，薄膜のエッチングまたは堆積を通して半導体産業に使われる。大多数のプロセス・チェンバーは，プラズマを作り，維持するために高周波 (RF) 電力を使う。信頼性，そしてプラズマの反復性はウエーハ処理結果に直接衝撃を与えるために，RF電力供給システムは半導体製造技術の重要な要素である。全RF（高周波）電力発生システムの正確で再現可能な性能，影響されるRFを含む，プラズマのパラメータが，一般に認められた許容限度範囲内でなければならない。

Semiconductor Metrology Instruments StdPbc-0921 Measurement Data Summary Technique andCourse Description The THORS Semiconductor Metrology Instruments course introduces the learners to the various instruments used in semiconductor testing. This course focuses on wafer inspection instruments used in semiconductor testing. This course focuses on wafer inspection systems, which are used for identifying defects, and process control metrology instruments, which are used for measuring various aspects of semiconductor manufacturing processes.