MS00300 - SEMI MS3 - Terminology for MEMS Technology Revision:SEMI MS3-0307 - Superseded SEMI E40-0702 (technical revision)

SEMI E40-0702 (technical revision)

nondestructive measurement of the thickness and the TTV of clean

visible and IR interferometry

some of which quantify more specific aspects

SEMI MF1188-0305 (technical revision)

MS00300 - SEMI MS3 - Terminology for MEMS Technology Revision:SEMI MS3-0307 - Superseded SEMI E40-0702 (technical revision)This Standard was technically approved by the MEMS NEMS Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 19, 2015. Available at www. semiviews. org and www. semi. org in September 2015; originally published as SEMI PR11 1105; previously published March 2007. Microelectromechanical Systems (MEMS) technology, while related in many ways to integrated circuit and device technology,