HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices StdTpc-Cluster Tools SEMI E111 — Specification for

SEMI E111 — Specification for a 150mm Reticle SMIF Pod (RSP150) Used to Transport and Store a 6 Inch Reticle

Bonding wire

The concentration for each impurity/dopant can be obtained by application of Beer’s Law

SEMI MF728-1106 (technical revision)

and micro-bump are developed to ensure high-yield of the middle-end process

HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices StdTpc-Cluster Tools SEMI E111 — Specification forThis Standard was technically approved by the HB LED Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 17, 2018. Available at www. semiviews. org and www. semi. org in December 2018; originally published June 2013. This Specification provides the dimensional requirements for plastic and metal wafer cassettes used for the processing and handling of 150 mm diameter HB LED