G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages StdPbc-0718 SEMI PV52 — Test Method

SEMI PV52 — Test Method for In-Line Characterization of Photovoltaic Silicon Wafers Regarding Grain Size

本ガイドは，MEにおける化学反応によるF-GHGの消費，残留，副生成物，組み換えについての特性評価に適用される。

The interpretation of the variations measured as radial variations may be in error if azimuthal variations on the wafer or axial variations along the crystal length are not negligible

SEMI D74-0116 (first published)

SEMI E140-0312 (technical revision)

G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages StdPbc-0718 SEMI PV52 — Test MethodThis document is a guideline for ordering the tooling required to manufacture plastic semiconductor packages. These packages include the following JEDEC registered outlines: Plastic Dual in Line Packages (PDIP); Plastic Leaded Chip Carrier (PLCC); Plastic Quad Flat Packages (PQFP); Small Outline I. C. Packages (SOIC Gull Wing and "J" lead); and Plastic TAB Quad Packages (PTAB)Title. Referenced SEMI Standards SEMI G48 Specification, Measurement Method