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G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title SEMI E126-0305 (technical revision)
G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title SEMI E126-0305 (technical revision)
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Description
SEMI E126-0305 (technical revision)
SEMI MS2 — Test Method for Step Height Measurements of Thin Films
2-0316 (Reapproved 0124)
Topic & Readings
NOTICE: This Document was completely rewritten in 2008
G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title SEMI E126-0305 (technical revision)This document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line toolmakers as the basis for defining the limits of manufacturing tolerances. Referenced SEMI Standards None.
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