G06800 - SEMI G68 - 空気環境における半導体パッケージのジャンクション部とケース間の熱抵抗測定の試験方法 StdPbc-0217 Test methods have been shown

Test methods have been shown to give statistically valid results

safe and efficient recipe operation for production execution by the host

It defines also how to apply an orientation fiducial mark on an otherwise unmarked wafer

1  This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure processed wafers to be used in a 3DS-IC process

Compared with damp heat (DH) tests

G06800 - SEMI G68 - 空気環境における半導体パッケージのジャンクション部とケース間の熱抵抗測定の試験方法 StdPbc-0217 Test methods have been shownglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards SEMI G30 Test Method for Junction to Case Thermal Resistance Measurements of Ceramic Packages SEMI G32 Guideline for Unencapsulated Thermal Test Chip SEMI G38 Test Method for Still and Forced Air Junction to Ambient Thermal Resistance Measurements of Integrated Circuit Packages SEMI