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G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI M56-1018 (Reapproved 1023)
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI M56-1018 (Reapproved 1023)
$115.50
Description
SEMI M56-1018 (Reapproved 1023)
SEMI P40-1109 (Reapproved 0416)
used to ship
Thermal equipment
A brief description of the theory of this Test Method is given in Related Information 1
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI M56-1018 (Reapproved 1023)global Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards None.
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
 - Superseded SEMI M56-1018 (Reapproved 1023)){kind=link}
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