SEMI103 Hybrid Integration Techniques for Flexible Electronics StdPbc-0718 such as concave or convex

such as concave or convex

1 — SECS-II Support for Event Reporting Standard

The approach is practical and project-based

3 This Document applies to the class of prober equipment in which the wafer is unloaded from the same slot in the same carrier which loaded the wafer after processing

2-0621 (Reapproved 0723)

SEMI103 Hybrid Integration Techniques for Flexible Electronics StdPbc-0718 such as concave or convexTCourse Description This course describes techniques practiced at Palo Alto Research Center for fabricating flexible hybrid electronics. Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits, and integrating sensors of different types. The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates and also the development of electronics on textiles. Course Objectives