G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 - Superseded Standardized scan patterns for both

Standardized scan patterns for both local and full-area surface characterization

5  The values stated in SI units are to be regarded as the standard

7-0304 (technical revision)

表面の準備：活性化の前には化学的処理を実施してはならない。

Standardized test methods for measuring them are required to avoid disagreement between business partners regarding wafer quality and specification

G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 - Superseded Standardized scan patterns for bothNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification is a guideline for production of DIP leadframes for plastic molded semiconductor packages produced by the etching process. It is a design guideline for packaging engineers, etchers, and mold manufacturers